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The Watson School
Office of Engineering
Professional Development
2008 Electronics Packaging Symposium
National Trends in Small Scale Systems and Microelectronics Packaging
Binghamton University
Watson Engineering
Professional Development
PO Box 6000
Binghamton NY 13902
Phone: 607.777.2154
Fax: 607.777.4411
email: ebrennan@binghamton.edu
