Electronics Packaging Symposium

 
Binghamton University

Binghamton University
Watson Engineering
Professional Development
PO Box 6000
Binghamton NY 13902

 
Phone: 607.777.2154
Fax: 607.777.4411
email: ebrennan@binghamton.edu
 

 

 

 

Electronics Packaging 2008 


This year's program is sponsored by The Watson School Office of Engineering Professional Development and “Small Scale Systems Integration and Packaging Center of Excellence” at Binghamton University
and
the GE Global Research Center

July 29 - 30, 2008
Niskayuna, New York

For information about registration and fees follow the links below or scan down the page...

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Payment
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Confirmation
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Cancellation and Refund Policy
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Maps and Directions (goes to GE Research site)

 

 

 

 

 

 

 

 

 


Fees

Regular Fee: $495
Student Fee: $195

GE employees fee: please contact (Watson professional dev. office contact information) or Arun Gowda at GE Global Research (gowda@ge.com).


Registration fees includes morning and afternoon refreshments, lunches, reception and parking.  Please inform us ahead of any dietary restrictions.

Advance registration is mandatory! Registration deadline: July 22, 2008. Due to security restrictions, no one will be admitted to the program without advanced enrollment. Register early to ensure a seat.  You may register by the following methods:

On Line (preferred method) Click here for online registration form

Fax completed registration form to 607-777-4411,  24 hours a day.

Mail the completed registration form  to:

Office of Engineering Professional Development
Watson School of Engineering and Applied Science
Binghamton University
State University of New York
PO Box 6000
Binghamton, NY 13902-6000

For questions about registrations telephone 607-777-2154 8 a.m. - 4 p.m. Toll Free:  888-691-1465. You cannot register by phone. We need a paper copy of the registration for audit purposes.

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Maps and Directions

The program will be of particular value to: development engineers, technical managers, researchers, application specialists, and strategic planners from industry, universities and government laboratories. There will be a special segment of keynote presentations providing a broad overview of recent developments in several areas vital to small scale systems and microelectronics packaging.

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How to make a payment

Payment must be made before the start of the program. All payments including credit cards will be processed by July 20, 2007. Any cancellations or nonattendance after this date will not receive a refund.

  • Please make checks payable to Research Foundation Award 27061

  • Purchase Orders:
    Purchase Orders must state course name, registrant's name and invoice number and provide a contact name and address .

  • Credit Cards    VISA         MasterCard           
    The university can only accept VISA or MasterCard

    Include:
    Card number
    Name of the card holder
    Expiration date
    Street number and zip code of card holder
    If registering on line, do not include card number etc.  Submit the registration first and then call our office for a secure credit card transaction.  
    607-777-2154    or    888-641-146

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Confirmation of your registration

We will send confirmation and course information to registrants by e-mail, so please make sure you include your e-mail address on your registration form. If you have not received confirmation seven days before the start of the program, call the Office of Engineering Professional Development at 607-777-2154. Toll free: 1-888-691-1465.

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Cancellation and refund policy

To cancel a registration and receive a full refund you must call, e-mail or fax our office  five business days prior to the start of the program. (Before July 21, 2008) All payments including credit cards will be processed by July 21, 2008. Any cancellations or nonattendance after this date will not receive a refund.  If you do not cancel and do not attend the program, you are responsible for full registration payment. Substitutions may be made up to 5 days before the beginning of the course by informing the Office of Engineering Professional Development. The Office of Engineering Professional Development reserves the right to limit enrollments.

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