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July
29 - 30, 2008 An outline of the schedule appears below. Details will be added frequently .....
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| Tuesday, July 29 in the GE Research Center Conference Center | ||
| 7:00 - 8:00 am | Registration and Continental Breakfast (Gallery) | |
| 8:00 - 8:15 am | Welcome
and Opening Remarks - Jerry Trant - GE Global Research |
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Keynote
Session chaired by Dr. Baghat Sammakia - Binghamton University |
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| 8:20 - 9:00 am | Dr. Edward Shaffer - Army Research Lab |
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| 9:00 - 9:40 am | Susan Rogers - Department of Energy |
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| 9:40 - 9:55 am | Break (Gallery) |
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| 9:55 - 10:35 am | Gerald Castellucci - National Instititute of Standards and Technology |
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| 10:35 - 11:15 am | Mark Hartney - US Display Consortium "The US Display Consortium Program on Printed and Flexible Electronics" |
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| 11:30 - 1:00 pm | Lunch: Speaker - Baghat Sammakia- Binghamton University |
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Steinmetz Auditorium |
Langmuir Lyceum |
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 top of page |
Thermal
Management I Chair: Bahgat Sammakia - Binghamton University |
Lead Free Electronics - I Chair: Charles Woychik - GE Global Research |
| 1:00 - 1:35 pm | Brian Smith - IBM Research Laboratory, Zurich "HNC: Hierarchically Nested Channels to Control Bond Line Formation in Thermal Interfaces" |
Charles Richardson - iNEMI "A Proactive Approach to Improving Environmental Performance" |
| 1:35 - 2:10 pm | Girish Upadhya - Emerson Network Power "Active Microstructure Cooling for High Heat Flux Applications" |
John Osenbach - LSI Logic "Current State of Understanding of Sn-whiskers:" |
| 2:10 - 2:45 pm | Dr. William Gerstler - GE Global Research "Realizing Benefits of High Efficiency – High Temperature Devices From a Thermal Management Systems Level Perspective" |
Marie S. Cole - IBM "Qualification of a Lead-Free Card Assembly & Test Process for a Server Complexity PCBA" |
| 2:45 - 3:00 pm | Break |
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Thermal Management II Chair: Todd Wetzel - GE Global Research |
Interconnect Reliability - I |
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| 3:00 - 3:35 pm | Philip Deane - Nextreme Thermal Solutions "Thin-Film Thermoelectric Thermal Bump for Cooing Hot Spots of High Performance Microprocessors" |
Cemal Bassaran - University at Buffalo Interconnect Reliability |
| 3:35 - 4:10 pm | Y.C. Lee - University of Colorado "Micro/Nanotechnology for Barrier Coatings and Flexible Thermal Ground Planes" |
Douglas C. Hopkins - University at Buffalo "Low Temperature Electromigration and Thermomigration in Lead-free Solder Joints." |
| 4:10 - 4:20 pm | Break |
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Advanced Packaging - Challenges Chair: Rich Beaupre - GE Global Research |
Interconnect Reliability - II Chair: John Osenbach - LSI Logic |
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| 4:20 - 4:55 pm | Ljubisa Stevanovic - GE Global Research Advanced Packaging for Silicon Carbide Power Devices |
Mark D. Poliks - Endicott Internconnect "Electrical, Mechanical and Reliability Performance of Nano-Micro-Filled Conducting Adhesives for z-axis Interconnections" |
| 4:55 - 5:30 pm | Scott Leslie - Powerex "Challenges for Advanced High Power Module Packaging" |
Kevin Knadle - Endicott Interconnect "Reliability and Failure Mechanisms of Laminate Substrates with Plated Interconections-- the effect of Via Structure and Materials in a Pb-free World." |
| 4:55 - 6:30 pm | Cocktail
Hour (Gallery) |
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| 6:30 - 8:30 pm | Dinner (Gallery) |
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| Wednesday, July 30 in the GE Research Center Conference Center | ||
| 7:30 - 8:00 am | Continental Breakfast (Gallery) |
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Steinmetz Auditorium |
Langmuir Lyceum |
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Special Session - Alternate Energy Chair: Todd Tolliver - GE Global Research |
MEMS Packaging Chair: K. Subramanian - GE Global Research |
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| 8:00 - 8:35 am | Harry Efstathiadis- University of Albany Powering the Future with NanoTechnology |
Marco Moraja - SAES Getters |
| 8:35 - 9:10 am | Rick Lewandowski - Prism Solar "Benefits of Advanced Holographic Optics In Photovoltaic" |
Steve Riches - GE Aviation Systems Manufacturing Challenges for MEMS Packaging |
| 9:10 - 9:45 am | Alok C. Rastogi - Binghamton University "Emerging Nanotechnology Approaches for Solar Photovoltaic Cells over Flexible Platform" |
Sam Zhang - Analog Devices |
| 9:45 - 10:00 am | Break | |
Advanced Packaging - Materials and Processes Chair: Shubhra Bansal - GE Global Research |
High Temperature Packaging Chair: David Shaddock - GE Global Research |
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| 10:00 - 10:35 am | Dan Goia - Clarkson University "Synthesis and Applications of Highly Dispersed Uniform Metallic Particles" |
Steven T. Riches - GE Aviation Systems "Assessment of the Reliability of High Temperature Electronics Packaging Technology" |
| 10:35 - 11:10 am | Christopher Ober - Cornell University "Orthogonal Processing in Flexible Electronics" |
Liang-Yu Chen - NASA/Glenn Research Center "Harsh Environment/High Temperature" |
| 11:10 - 11:45 am | Michael Mayer - University of Waterloo "Improving Microelectronic Wire Bonding: New Bonding Materials, Process Methods, and Microsensor Applications" |
William Gerstler - GE Global Research Realizing Benefits of High Efficiency High Temperature Devices From a Thermal Management Systems Level Perspective |
| 12:00 - 1:00 pm | Lunch (Gallery) |
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| 1:00 pm | Adjournment |
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